College Intern - R&D Mechanical Hardware Engineering (Simulation) (hp)

Job Description

College Intern - R&D Mechanical Hardware Engineering (Simulation)

Description -

What a College Intern - R&D Mechanical Hardware Engineering (Simulation) does at HP:

• Develop portions of Finite Element Analysis (FEA) model of mechanical and thermal hardware, conduct simulation of product level tests and analyze results to provide insights to other mechanical hardware engineers and internal and outsourced development partners on next phase mechanical design and development.JOB IS FROM: nursingjobs.siteVIEW

• Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with provided specifications and requirements.

• Implements established test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.

• Develops understanding and build relationship with internal and outsourced development partners on mechanical design and development.

• Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.

Individuals who do well in this role at HP, usually possess:

• Currently studying a Bachelor's or Master's in Mechanical Engineering or similar fields.

• Available for a 5-6 months internship, starting in Jan 2025.

• Experience or understanding of CoCreate Creo Elements Direct Modelling/ProEngineer or other 3D CAD software as a mechanical design tool.

• Experience or understanding of Altair Hyperworks, ANSYS or other 3D Finite Element Analysis (FEA) modelling software is highly preferable.

• Good analytical and problem solving skills.

• Understanding of design for sheet metal and plastic parts and associated production tooling and processes.

• Understanding of mechanical and thermal properties of materials.

Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.

 

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Job -

Administration

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

No

Relocation -

No

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement