2024 - 2025 Process Development Engineer Intern (nxp)

nxp Bangkok 2024-12-11

Job posting number: #161168 (Ref:R-10055833)

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Job Description:

Support Wire bond Assembly Package Innovation (API) Engineers on daily activities related to their Development Projects
JOB IS FROM: nursingjobs.siteVIEWWill be assigned to work on Special Projects for improvement of wire bond process
Will be assigned to support Cost reduction projects; such as UPH improvement
Will collaborate with their University Professor to do research on technical papers/ journals for deeper understanding on the solution of the problems encountered with wire bond process

Job Qualification:

The candidate must be studying a bachelor’s degree in Micro- Electronic. Electronic and other Engineering.
Interpersonal skills
English communication skills, both written and spoken
Experienced in making presentation/s using Microsoft Power Point software
Experienced in using Microsoft Excel software to be used for data gathering and analysis

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